Bonded Type Heat Sink

We offer an extensive range of customized bonded fins drawing which is available at industry leading prices. These are available in various sizes and can be customized as per the clients requirement. Our products are known for their robust construction, high tensile strength and corrosion resistance.

Dimensions:

• Fins thickness : 1 to 2mm
• Width : up to 400mm
• Height : up to 150mm

We are engaged in offering a comprehensive range of customized bonded fins which can be manufactured as per the drawing given by the client. These are reckoned for their optimum quality and cost effective prices. Our products are ideal for various thermal solutions.

Dimensions:

• Fins thickness : 1 to 2mm
• Width : up to 400mm and
• Height :  up to 150mm

Bonded fin heat sink offer thermal design engineers many benefits over conventional extruded aluminum heat sinks. The increased fin count of bonded fin heat sinks is the result of a tightly controlled assembly technique, allowing fin manufacture as a process independent from base extrusion.

We offer a comprehensive range of fins type heat sinks which find applications in various industries These are manufactured using quality tested raw material and are available in various sizes. Our range of product is widely demanded by our clients for its various notable features such as optimum quality, excellent performance and corrosion resistance.

Features:

• Sturdiness
• High tensile strength
• Robust construction
• Durability

Dimensions:

• Fins thickness : 1 to 2mm
• Width : Up to 400mm
• Height : Up to 150mm

Quality being a significant issue of concern for our entity, we are engrossed in offering to our customers a wide assortment of  SMPS Enclosure Heat Sink .

Additional Information:

• Item Code: 0000015

The Bonded Fin Advantage

Bonded fin heat sinks offer thermal design engineers many benefits over conventional extruded aluminum heat sinks. The increased fin count of bonded fin heat sinks is the result of a tightly controlled assembly technique, allowing fin manufacture as a process independent from base extrusion.

This process removes the conventional fin extrusion ratio limitation dictated by the strength of the steel in extrusion dies. Ratios greater that 6:1 (fin height above the base as compared to the narrowest open space between fins) are common place, but ratios of 8:1 and 10:1 can be done on a limited basis.

Bonded-fin parts offer fin ratios as high as is practical, up to 30:1 and beyond. Increasing the number of fins increases the surface area exposed to cooling air, and greater exposed surface area means more heat transferred away from the electronics.

Features and Benefits
• Dissipate more heat than conventional heat sinks with the same footprint
• Reduce heat sink and overall system volume
• Increase the aluminum extrusion cooling surface area by two to three times

Applications
• Thermoelectric modules
• Uniterruptable power supplies
• Variable speed motor controls
• AC welding switches
• Power rectification equipment
• Laser power supplies
• Traction drives

Additional Information:

• Item Code: 215X600X115

Quality being a significant issue of concern for our entity, we are engrossed in offering to our customers a wide assortment of  SMPS Enclosure Heat Sink

Quality being a significant issue of concern for our entity, we are engrossed in offering to our customers a wide assortment of Anodizing Heat Sink

Additional Information:

• Item Code: 100X95X20

We provide an extensive range of Diode Transistor & Thyristor Heat Sink which is available in the various sizes and dimensions. These are manufactured using quality tested raw material and are known for their various high end features such as optimum efficiency and durable construction. To meet the varied requirements of our client.

We also customize these on various parameters, as follow:

Product Details:

Quality being a significant issue of concern for our entity, we are engrossed in offering to our customers a wide assortment of Inverter Heat Sink .

Product Details:

Himalay Engineering offers several methods for cooling IGBT modules - cold plates, extruded aluminum heat sinks, bonded fin heat sinks and fan-cooled modules. Air cooling is the conventional preference of design engineers due to low system cost and proven reliability and has been used for decades. Many styles of air cooled heat sinks are available to meet a wide variety of needs. Air cooling is most effective for lower power and lower power density semiconductor components and can be a limiting factor in many high density system packages. Bonded fin heat sinks achieve a 2 to 3 times greater surface area than conventional aluminum extrusions. This allows heat removal to be increased at a given temperature rise allowing greater design flexibility in a set heat sink volume. Although slightly more expensive than aluminum extrusions bonded fin parts actually save money due to smaller size and decreased thermal resistance.

Extrusions:

Conventional aluminum extrusions are offered in a wide variety of shapes, thermal performances and sizes. Available in thousands of tooled shapes new extrusions are relatively inexpensive and quick to tool. Fin extrusion ratios (fin height to open spacing between fins) do limit the number and height of fins in aluminum extrusion and can limit the area available for heat removal.

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer)

Bonded Type Heat Sink. We are manufactures of Aluminum Heat Sinks.
300/300/550 mm 

We are engaged in offering a comprehensive range of customized bonded fins drawing which are known for their smooth operation and longer service life. These manufactured using top quality raw material and are known for their optimum quality and cost effective prices. Our products are available in various sizes and can be customized as per the client requirement.

Dimensions:

• Fins thickness : 1 to 2mm
• Width : up to 400mm
• Height : up to 150mm