Himalay Engineering Co.
Sakinaka, Mumbai, Maharashtra
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Heatsinks

Our product range includes a wide range of board level heat sink for electrical package, bonded heat sink, laptop heat sinks, flower type heat sinks, l heat sinks and mounting large holes.

Board Level Heat Sink for Electrical Package

Board Level Heat Sink for Electrical Package
  • Board Level Heat Sink for Electrical Package
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Himalay Engineering offers a large variety of widely used heat sinks in the industry. Design engineers looking for complete off-the-shelf thermal solutions need not look any further.
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Bonded Heat Sink

Bonded Heat Sink
  • Bonded Heat Sink
  • Bonded Heat Sink
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Bonded-Fin parts offer fin ratios as high as is practical. Increasing the number of fins increases the surface area exposed to cooling air, and greater exposed surface area means more heat transferred away from the electronics. In most typical air cooled applications - heat sinks are convection limited, and the overall thermal performance of an air cooled heat sink can often be improved significantly if more surface area can be exposed to the air stream. Wakefield Solution’s high performance Bonded-Fin heat sinks utilize thermally conductive metal-filled epoxy to bond planar fins onto a grooved extrusion base plate. This process allows for a much greater fin height-to-gap aspect ratio of 20 to40, greatly increasing the cooling capacity without increasing volume requirements.
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Laptop Heat Sinks

Laptop Heat Sinks
  • Laptop Heat Sinks
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We are a renowned name, which is engaged in offering Laptop Heatsink.
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Flower Type Heat Sinks

Flower Type Heat Sinks
  • Flower Type Heat Sinks
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L Heat Sinks

L Heat Sinks
  • L Heat Sinks
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Mounting Large Holes

Mounting Large Holes
  • Mounting Large Holes
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Reach Us
Ramesh Satra (CEO)
Raju Estate, Gala No. 3 - B - 4 - B, Kherani Road, Saki Naka
Mumbai- 400072, Maharashtra, India



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